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INTEGRATED CIRCUITS
DATA SHEET
TDA8772 Triple 8-bit video digital-to-analog converter
Product specification Supersedes data of 1995 Mar 09 File under Integrated Circuits, IC02 1997 Mar 06
Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog converter
FEATURES * 8-bit resolution * Sampling rate up to: - 35 MHz for TDA8772H/3 - 85 MHz for TDA8772H/8 * Internal reference voltage regulator * No deglitching circuit required * SYNC, BLANK control inputs * 3 independent clock inputs (one per DAC) * 1 V output voltage range * 75 output load * TDA8772 has BLANK control on the 3 channels * Single 5 V power supply * 44-pin QFP package. APPLICATIONS * General purpose high-speed digital-to-analog conversion * Digital TV * Graphic display * Desktop video processing. ORDERING INFORMATION TYPE NUMBER TDA8772H/3 TDA8772H/8 PACKAGE NAME QFP44 DESCRIPTION plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm VERSION SOT307-2 GENERAL DESCRIPTION
TDA8772
The TDA8772 is a triple 8-bit video Digital-to-Analog Converter (DAC). It converts the digital input signals into analog voltage outputs at a maximum conversion rate of 35 MHz (TDA8772H/3) and 85 MHz (TDA8772H/8). The DAC is based on resistor-string architecture with integrated output buffers. The output voltage range is determined by a built-in reference source. The device is fabricated in a 5 V CMOS process that ensures high functionality with low power dissipation.
SAMPLING FREQUENCY 35 MHz 85 MHz
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Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog converter
QUICK REFERENCE DATA SYMBOL VDDA VDDD IDDA IDDD PARAMETER analog supply voltage digital supply voltage analog supply current digital supply current TDA8772H/3 TDA8772H/8 INL DNL fclk(max) integral non-linearity2 differential non-linearity maximum clock frequency TDA8772H/3 TDA8772H/8 Ptot total power dissipation TDA8772H/3 TDA8772H/8 Note note 1 RL = 75 ; fclk = 35 MHz RL = 75 ; fclk = 85 MHz 180 180 360 405 35 85 - - - - fclk = 35 MHz; ramp input fclk = 85 MHz; ramp input fclk = 35 MHz; ramp input fclk = 85 MHz; ramp input - - - - - 7 16 0.5 0.75 0.25 0.5 RL = 75 ; note 1 CONDITIONS MIN. 4.5 4.5 40 TYP. 5.0 5.0 65
TDA8772
MAX. 5.5 5.5 100 16 27 1 1.2 0.5 0.75
UNIT V V mA mA mA LSB LSB LSB LSB MHz MHz mW mW
640 700
1. Minimum and maximum data of current and power consumption are measured in worse case conditions: for minimum data, all digital inputs are at logic level 0 while for maximum data, all digital inputs are at logic level 1.
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Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog converter
BLOCK DIAGRAM
handbook, full pagewidth
TDA8772
V DDA 35,39,43 4 8-5 4
V DDD 10,32 41 reference current input (I REFB ) RED clock input
RED digital inputs (bits R0 to R3)
TDA8772
LSB DECODER
21
RED digital inputs (bits R4 to R7)
4
4-1
4
MSB DECODER
RESISTOR STRING
44
RED analog output
GREEN digital inputs (bits G0 to G3)
4
20-17 4
LSB DECODER
22
GREEN clock input
GREEN digital inputs (bits G4 to G7)
4 16-13
4
MSB DECODER
RESISTOR STRING
40
GREEN analog output
BLUE digital inputs (bits B0 to B3)
4
31-28 4
LSB DECODER
23
BLUE clock input
BLUE digital inputs (bits B4 to B7)
4
27-24
4
MSB DECODER
RESISTOR STRING
36
BLUE analog output
BLANK control input SYNC control input
12 11 CONTROL REGISTER BANDGAP REFERENCE 34 reference voltage decoupling input (V REF ) 37,42 9,33
38
reference current input for internal reference (I REFA )
V SSA
V SSD
MBB661 - 2
Fig.1 Block diagram.
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Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog converter
PINNING SYMBOL R7 R6 R5 R4 R3 R2 R1 R0 VSSD1 VDDD1 SYNC BLANK G7 G6 G5 G4 G3 G2 G1 G0 CLKR CLKG PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 DESCRIPTION RED digital input data; bit 7 (MSB) RED digital input data; bit 6 RED digital input data; bit 5 RED digital input data; bit 4 RED digital input data; bit 3 RED digital input data; bit 2 RED digital input data; bit 1 RED digital input data; bit 0 (LSB) digital supply ground 1 digital supply voltage 1 composite sync control input; for GREEN channel only (active LOW) composite blank control input (active LOW) GREEN digital input data; bit 7 (MSB) GREEN digital input data; bit 6 GREEN digital input data; bit 5 GREEN digital input data; bit 4 GREEN digital input data; bit 3 GREEN digital input data; bit 2 GREEN digital input data; bit 1 GREEN digital input data; bit 0 (LSB) RED clock input GREEN clock input VDDA2 OUTG IREFB VSSA2 VDDA3 OUTR 39 40 41 42 43 44 B6 B5 B4 B3 B2 B1 B0 VDDD2 VSSD2 VREF VDDA1 OUTB VSSA1 IREFA 25 26 27 28 29 30 31 32 33 34 35 36 37 38 SYMBOL CLKB B7 PIN 23 24
TDA8772
DESCRIPTION BLUE clock input BLUE digital input data; bit 7 (MSB) BLUE digital input data; bit 6 BLUE digital input data; bit 5 BLUE digital input data; bit 4 BLUE digital input data; bit 3 BLUE digital input data; bit 2 BLUE digital input data; bit 1 BLUE digital input data; bit 0 (LSB) digital supply voltage 2 digital supply ground 2 decoupling input for reference voltage analog supply voltage 1 BLUE analog output analog supply ground 1 reference current input for internal reference analog supply voltage 2 GREEN analog output reference current input for output buffers analog supply ground 2 analog supply voltage 3 RED analog output
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Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog converter
TDA8772
V DDA3
39 V DDA2
37 VSSA1
38 I REFA
41 I REFB
40 OUTG
V DDA1 35
VSSA2
OUTB
handbook, full pagewidth
index corner R7 R6 R5 R4 R3 R2 R1 R0 V SSD1 1 2 3 4 5 6 7 8 9
44 OUTR
43
42
36
34
V REF
33 VSSD2 32 VDDD2 31 B0 30 B1 29 B2
TDA8772
28 B3 27 B4 26 B5 25 B6 24 B7 23 CLKB
V DDD1 10 SYNC 11
CLKR 21
12
G7 13
G6 14
G5 15
G4 16
G3 17
G2 18
G1 19
G0 20
CLKG 22
MBB660 - 3
BLANK
Fig.2 Pin configuration.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDDA VDDD VDD Tstg Tamb Tj PARAMETER analog supply voltage digital supply voltage supply voltage difference between VDDA and VDDD storage temperature operating ambient temperature junction temperature MIN. -0.5 -0.5 -1.0 -55 0 - MAX. +6.5 +6.5 +1.0 +150 70 125 V V V C C C UNIT
THERMAL CHARACTERISTICS SYMBOL Rth j-a HANDLING Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits. PARAMETER thermal resistance from junction to ambient in free air VALUE 75 UNIT K/W
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Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog converter
TDA8772
CHARACTERISTICS TDA8772H/3 operating at 35 MHz and TDA8772H/8 operating at 85 MHz unless otherwise specified. VDDA = VDDD = 4.5 V to 5.5 V; VSSA and VSSD shorted together; VDDA - VDDD = -0.5 V to +0.5 V; Tamb = 0 to +70 C; typical values measured at VDDA = VDDD = 5 V and Tamb = 25 C; unless otherwise specified. SYMBOL Supplies VDDA VDDD IDDA IDDD analog supply voltage digital supply voltage analog supply current digital supply current TDA8772H/3 TDA8772H/8 Inputs CLOCK INPUTS (PINS 21 TO 23) VIL VIH VIL VIH VIL VIH Ii(REFA) Ii(REFB) LOW level input voltage HIGH level input voltage VSSD - 0.5 2.0 VSSD - 0.5 2.0 VSSD - 0.5 2.0 - - - - - - - - 0.17 0.8 V VDDD + 0.5 V 0.8 V - - 7 16 16 27 mA mA RL = 75 ; note 1 4.5 4.5 40 5.0 5.0 65 5.5 5.5 100 V V mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
BLANK, SYNC INPUTS (PINS 12 AND 11; ACTIVE LOW) LOW level input voltage HIGH level input voltage VDDD + 0.5 V 0.8 V
R, G, B DIGITAL INPUTS (PINS 1 TO 8, 13 TO 20 AND 24 TO 31) LOW level input voltage HIGH level input voltage VDDD + 0.5 V 0.25 mA
IREFA INTERNAL REFERENCE SUPPLY CURRENT (PIN 38) input current IREFB OUTPUT BUFFER SUPPLY CURRENT (PIN 41) input current 0.5 0.7 mA Timing (CL = 25 pF; RL = 75 ); see Fig.3 fclk(max) maximum clock frequency TDA8772H/3 TDA8772H/8 tCPH tCPL tr clock pulse width HIGH clock pulse width LOW clock rise time TDA8772H/3 TDA8772H/8 tf clock fall time TDA8772H/3 TDA8772H/8 tSU;DAT tHD;DAT input data set-up time input data hold time - - 4 2.5 - - - - 5 3 - - ns ns ns ns - - - - 5 3 ns ns 35 85 5 5 - - - - - - - - MHz MHz ns ns
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Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog converter
SYMBOL PARAMETER CONDITIONS MIN. TYP.
TDA8772
MAX.
UNIT
Voltage reference (pin 34, referenced to VSSA) Vref Outputs OUTB, OUTR, OUTG ANALOG OUTPUTS (PINS 36, 44 AND 40, REFERENCED TO VSSA) RL = 75 ; SEE TABLES 1 AND 2 FSR Vos VOUTmax VOUTmin THD full-scale output voltage range offset of analog voltage output maximum output voltage minimum output voltage total harmonic distortion data inputs = logic 1; note 2 data inputs = logic 0; note 2 fi = 4.43 MHz; fclk = 35 MHz fi = 4.43 MHz; fclk = 85 MHz ZL INL DNL CT m output load impedance Transfer function integral non-linearity differential non-linearity crosstalk DAC to DAC DAC to DAC matching fclk = 35 MHz; ramp input - fclk = 85 MHz; ramp input - fclk = 35 MHz; ramp input - fclk = 85 MHz; ramp input -45 - - - - - 0.5 0.75 0.25 0.5 - 1.0 1 1.2 0.5 0.75 - 2.0 - - - - LSB LSB LSB LSB dB % 0.9 0.75 1.65 0.75 - - 60 1.0 0.83 1.83 0.83 -45 -43 75 1.1 0.95 2.05 0.95 - - 90 V V V V dB dB output reference voltage 1.180 1.242 1.305 V
Switching characteristics (RL = 75 ); see Fig.4 td ts1 ts2 Vg Notes 1. Minimum and maximum data of current and power consumption are measured in worse case conditions: for minimum data, all digital inputs are at logic level 0 while for maximum data, all digital inputs are at logic level 1. 2. VOUT is directly proportional to Vref. input to 50% output delay time settling time settling time full-scale change 10% to 90% full-scale change to 1 LSB 10 6 30 ns ns ns
Output transients (glitches) area for 1 LSB change 1 LSB.ns
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Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog converter
Table 1 Input coding and DAC output voltages (typical values) BINARY INPUT DATA (SYNC = BLANK = 0) 0000 0000 0000 0001 .... .... 1000 0000 .... .... 1111 1110 1111 1111 Table 2 CODE 0 1 . 128 . 254 255
TDA8772
DAC OUTPUT VOLTAGES (V) OUTB, OUTR, OUTG RL = 75 0.830 0.834 . 1.330 . 1.826 1.830
Input coding and DAC output voltages (typical values) DAC OUTPUT VOLTAGES (V) SYNC (PIN 11) x 1 0 BLANK (PIN 12) 1 0 0
BINARY INPUT DATA .... .... .... .... .... ....
OUTG (PIN 40) see Table 1 0.830 0.440
OUTR/B (PINS 44, 46) see Table 1 0.830
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Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog converter
TIMING
TDA8772
andbook, full pagewidth
t SU; DAT
t HD; DAT V IH
data input
stable
50 % V IL
clock input
MBB656 - 1
50 % V IL t CPL t CPH
Fig.3 Input timing.
handbook, full pagewidth
clock input
50 % code 1023 code 0
input code (example of a full-scale input data transition)
714 mV (code 1023)
1 LSB 10 %
td
50 %
Vo(1)
90 % 54 mV (code 0) t s1 t s2 1 LSB
MBB662 - 3
Fig.4 Switching timing.
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Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog converter
INTERNAL CIRCUITRY
TDA8772
handbook, full pagewidth
V DDD
V DDA
GND
DACs resistor string V SSA
V SSD
(a)
(b)
V DDA
V DDA
V DDA V DD
V DD
V DD
V DD
25 (typ) GND
V SSA
(c)
(d)
GND
GND
GND
VSSA
VSSA
MBB663 - 2
(e)
(a) Digital inputs; pins 1 to 8 and 11 to 31. (b) Vref; pin 34. (c) IREFA; pin 38. (d) OUTR, G, B; pins 44, 40 and 36. (e) IREFB; pin 41.
Fig.5 Internal circuitry.
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Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog converter
APPLICATION INFORMATION
TDA8772
handbook, full pagewidth
V SSA 5 V OUTR 75 10 nF V SSA
V SSA 5 V OUTG 8.2 k 75 OUTG 40 10 nF
VSSA 33 k
V SSA 5 V OUTB 75
10 nF
V SSA 100 nF
V SSA
VSSA VDDA1 V REF
V DDA3 VSSA2 IREFB 44 R7 1 43 42 41
V DDA2 IREFA 39 38
V SSA1 36
37
35
34 33 V SSD2 V DDD2
R6
2
32
5V 10 nF V SSD B0
R5
3
31
R4
4
30
B1
R3
5
29
B2
R2
6
TDA8772
28
B3
R1
7
27
B4
R0
8
26
B5
V SSD1 V DDD1 10 nF V SSD SYNC
9
25
B6
5V
10
24
B7
11 12 13 14 15 16 17 18 19 20 21 22
23
CLKB
MBB664 - 4
BLANK
G7
G6
G5
G4
G3
G2
G1
G0
CLKR
CLKG
Analog and digital supplies should be separated and decoupled. Supplies are not connected internally. All ground pins must be connected. One ground plane is preferred although it depends on the application. See Fig.7 for example of anti-aliasing filter.
Fig.6 Application diagram.
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Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog converter
TDA8772
handbook, full pagewidth
TDA8772
25 OUTR (pin 44) and OUTG (pin 40) and OUTB (pin 36)
1 H
1 H
12 pF
12 pF 75
analog video output (R,G or B) 1 V (p-p)
220 pF
1.5 nF
220 pF
MSA692 - 1
analog ground
Fig.7 Example of anti-aliasing filter for 1 V output swing.
Characteristics of Fig.8 * Order 5; adapted CHEBYSHEV
handbook, halfpage
MSA691
0
* Ripple 0.6 dB * Frequency at -3 dB = 6.5 MHz * fNOTCH = 46 MHz.
(dB)
50
100
150
200
0
36
72
f (MHz)
108
Fig.8 Frequency response for filter shown in Fig.7.
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Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog converter
PACKAGE OUTLINE QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm
TDA8772
SOT307-2
c
y X
A 33 34 23 22 ZE
e Q E HE wM bp pin 1 index 44 1 bp D HD wM 11 ZD B vM B vMA 12 detail X A A2 A1 (A 3) Lp L
e
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.10 A1 0.25 0.05 A2 1.85 1.65 A3 0.25 bp 0.40 0.20 c 0.25 0.14 D (1) 10.1 9.9 E (1) 10.1 9.9 e 0.8 HD 12.9 12.3 HE 12.9 12.3 L 1.3 Lp 0.95 0.55 Q 0.85 0.75 v 0.15 w 0.15 y 0.1 Z D (1) Z E (1) 1.2 0.8 1.2 0.8 10 0o
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT307-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-02-04
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Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog converter
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all QFP packages. The choice of heating method may be influenced by larger plastic QFP packages (44 leads, or more). If infrared or vapour phase heating is used and the large packages are not absolutely dry (less than 0.1% moisture content by weight), vaporization of the small amount of moisture in them can cause cracking of the plastic body. For more information, refer to the Drypack chapter in our "Quality Reference Handbook" (order code 9397 750 00192). Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering
TDA8772
Wave soldering is not recommended for QFP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. If wave soldering cannot be avoided, the following conditions must be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The footprint must be at an angle of 45 to the board direction and must incorporate solder thieves downstream and at the side corners. Even with these conditions, do not consider wave soldering the following packages: QFP52 (SOT379-1), QFP100 (SOT317-1), QFP100 (SOT317-2), QFP100 (SOT382-1) or QFP160 (SOT322-1). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
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Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog converter
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8772
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
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Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog converter
NOTES
TDA8772
1997 Mar 06
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Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog converter
NOTES
TDA8772
1997 Mar 06
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Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog converter
NOTES
TDA8772
1997 Mar 06
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For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1997
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SCA53
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Printed in The Netherlands
547047/1200/06/pp20
Date of release: 1997 Mar 06
Document order number:
9397 750 01836

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